PCB Layout Engineer, Intern

2 weeks ago


Ho Chi Minh City, Ho Chi Minh, Vietnam Ampere Computing Full time

The role


As a PCB Layout Engineer, intern, you will help Layout project leads for a variety of high-speed PCB layouts for Chip validation, customer reference and layout review.

You will review Gerber data, fab & assembly drawings for manufacturing. You will check new footprints to make sure they follow our rules and datasheets.

What the Team wants you to know


The team is an integral part of server platform process that ensures our product get the absolute highest quality products that meets their functional and performance requirements.

Designing PCB for high-speed signals such as PCIe5, CCIX, DDR5... is very challenging and difficult job. Low cost and high density also make it more complicated.

The PCB Layout Team at Ampere Computing comprises of stellar folks who have dedicated themselves to make best product, collaborate with SI and Hardware teams to deal problems, some challenges but very fun on working.


What you'll do

  • Work with a team of engineers to perform component placement and Multi-Layer PCB routing.
  • Talk to Mechanical team to exchange data between PCB and Mechanical.
  • Build and maintain an Allegro Library database, create footprints.
  • Optimize routing for highspeed signals and plane for power delivery.
  • Export Gerber data to FAB and Assembly houses.

What you'll bring

  • Experience of some hardware projects at your school is preferred
  • Experience of Cadence Allegro, and PADS PCB tools.
  • Experience of some aspects of PCB design: footprint, netlist, constraint setup, placement, routing, and generating Gerbers.
  • General understanding of electronic circuits and chip functionality.
  • Able to read and understand schematics.
  • Good communication skills in English and Vietnamese.

Education

Our Company

Our Story
Like the scientist behind its name, Ampere employees are innovators. We understand the needs of cloud computing and different software requirements.

We are inventing what comes next and looking at everything from the structure of memory and how efficient the system is, to considerations on speed, cost of electricity and ability to cool.

Power, size, weight and cost are driving the technology requirements and the innovation to come.

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